Silica and a silica-based slurry

This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for ch...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: McCann, Colin, Hellring, Stuart, Babu, Suryadevara, Li, Yuzhuo, Narayanan, Satish
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.