Sterilization system employing low frequency plasma

A method and system for sterilizing an article is provided that includes use of a low frequency (LF) gas discharge plasma. The method includes placing the article in a vacuum chamber and evacuating the vacuum chamber to a predetermined pressure. Gas or vapor species are introduced into the vacuum chamber, and a low frequency plasma is generated within the vacuum chamber, the low frequency plasma having a frequency of from 0 to approximately 200 kHz. The low frequency plasma is maintained for a time period sufficient to substantially remove gas or vapor species from the article. The sterilization system includes a vacuum chamber coupled to a vacuum pump and a vent, a first electrode, and a second electrode. The sterilization system further includes a second region within the vacuum chamber, the second region including a region between the first and second electrodes, and a first region within the vacuum chamber, the first region being in fluid communication with the second region. The sterilization system further includes a source of reactive agent species coupled to the vacuum chamber, a process control monitor, and a low frequency power module including components adapted to apply a low frequency voltage between the first electrode and second electrode to generate a low frequency plasma in the vacuum chamber, the low frequency voltage having a frequency of from 0 to approximately 200 kHz.