Selective deposition of circuit-protective polymers

A composition for electrophoretic deposition of a protective coating. The composition comprises a cationic resin emulsion; and a curative mixed with the cationic resin emulsion. The composition after electrophoretic deposition and curing provides the protective coating that has a concentration of extractable ionic contaminants less than about 200 nanograms/cm 2 ; and a concentration of labile components less than about 36,000 nanograms/cm 2 . The present invention further includes an article in the form of a flexible printed circuit, used as an interconnect, comprising a film substrate and a plurality of conductive traces adjacent to a surface of the film substrate to receive an insulating coating using electrophoretic deposition techniques.