DETAILING TOOL FOR SUBSTRATES HAVING A SELF-ALIGNMENT FEATURE

A detailing tool for processing electronic component substrate includes a supporting frame, a substrate carrier movable on the supporting frame to receive and secure the substrate during processing by the tool, and a pair of cutter assembly attached to said supporting frame for removing tails on said substrate. The cutter assemblies self-align "to" the substrate during initial substrate loading in a processing area of the tool. Each cutter assembly includes a pair of spaced, translatable and opposed cutters that simultaneously move towards each another while removing the tails from the corners of the substrate that remains stationary. The pair of cutter assemblies are symmetrically attached to the supporting frame with respect to an axis for indexing the substrate. Thus, the invention provides a tool for cutting tails from opposite corners on the substrate edge automatically and simultaneously during processing.