Distributed power supplies for microelectronic workpiece processing tools

An apparatus and method for processing microelectronic workpieces. The apparatus can include a housing at least partially enclosing a process environment, with a first processing chamber and a second processing chamber positioned within the housing. The first processing chamber can have a first electrically powered device, such as a first anode and/or a first cathode, and the second processing chamber can have a second electrically powered device, such as a second anode and/or a second cathode. A first power supply is electrically coupled to the first processing chamber to provide electrical power to at least one of a first anode and a first cathode, and a second power supply is electrically coupled to the second processing chamber to provide electrical power to at least one of the second anode and the second cathode. A first conductive link between the first power supply and the first processing chamber can be electrically decoupled from a second conductive link between the second power supply and the second processing chamber. The conductive links can have the same impedance, resistance, and/or length.