Bonding pad
A wire bonding pad of a semiconductor integrated circuit device includes a first, test portion to which a probe tip may be contacted, and a second, wire bonding portion to which a wire is bonded for electrically connecting the bonding pad to a carrier or lead frame. Providing a separate, test portio...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A wire bonding pad of a semiconductor integrated circuit device includes a first, test portion to which a probe tip may be contacted, and a second, wire bonding portion to which a wire is bonded for electrically connecting the bonding pad to a carrier or lead frame. Providing a separate, test portion prevents the wire bonding portion from being damaged by a probe tip during testing. |
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