COMPONENT AND METHOD FOR MANUFACTURE
A component ( 10 ) includes a substrate ( 15 ), a cap wafer ( 23 ), and a protection layer ( 28 ) formed over a surface of the cap wafer ( 23 ). Together, the protection layer ( 28 ) and the cap wafer ( 23 ) form a cap structure ( 39 ) that is bonded to the substrate ( 15 ) via a bonding layer ( 33...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A component (
10
) includes a substrate (
15
), a cap wafer (
23
), and a protection layer (
28
) formed over a surface of the cap wafer (
23
). Together, the protection layer (
28
) and the cap wafer (
23
) form a cap structure (
39
) that is bonded to the substrate (
15
) via a bonding layer (
33
). An opening (
47
) is formed in the cap wafer (
23
) by etching the cap wafer (
23
). The protection layer (
28
) provides protection during etching of the cap wafer (
23
) for the underlying bonding layer (
33
) and devices (
11,12
) formed in the substrate (
15
). |
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