Ink jet recording head, ink jet recording apparatus, and method for manufacturing ink jet recording head

To electrically suitably interconnect a recording element substrate on which power supply paths are formed in a high density and an electric wiring substrate on which wiring lines for supplying power to these paths are formed, such bumps are formed and arranged on the recording element substrate at a predetermined pitch therebetween as to protrude by a predetermined amount of t1 from this substrate. On the electric wiring substrate, on the other hand, connecting terminals are formed and arranged with the same pitch as that of the bumps. Between each two of the bumps is formed an insulating film which protrudes in the protrusion direction of the bumps by a predetermined amount t2 that satisfies a relationship of t1