APPARATUS FOR HIGH-SPEED HEATING AND COOLING OF A POLYMER

An apparatus and method for heating and cooling a polymer structure employs a tube structure. The tube structure includes a conductive tube and a conductive strip. The tube is composed of a first conductive material having a first electrical resistivity, and the strip is composed of a second conductive material having a second electrical resistivity less than the first resistivity. The strip is connected to only a portion of an outer surface of the tube and extends along a length of the tube. In the method, an impulse of electric current is passed through the tube structure until the strip is heated to a predetermined sealing temperature. The strip and the polymer structure are brought into contact with each other for a dwell time sufficient to generate a heat seal in the polymer structure. A cooling medium is passed through the tube to cool the strip to a predetermined release temperature that facilitates release of the strip from the polymer structure.