Chemical mechanical polish pad conditioning device

A chemical mechanical polish pad conditioning device is disclosed. The device includes a conditioning substrate made of stainless steel forming a predetermined pattern on a surface. Also, a method of producing a chemical mechanical polish pad conditioning device is disclosed. The method includes providing a conditioning substrate made of stainless steel forming a predetermined pattern on a surface, and applying a hardening process to the surface of the conditioning substrate. The invention further discloses a method of conditioning a chemical mechanical polish pad. The method includes providing a conditioning substrate forming a predetermined pattern on a surface, fixing the conditioning substrate to a conditioning arm, and contacting the surface of the conditioning substrate with a polish pad and moving the conditioning substrate on the polish pad with a predetermined downforce at a predetermined rate of speed. Because the conditioning substrate does not use a diamond layer bonded to the substrate, there is no risk that detached diamonds may become embedded in the polish pad in the course of polishing. Under the configurations of the conditioning device, production of a custom conditioning device that meets specified cut-rate or surface roughness specifications can be achieved