METHOD AND APPARATUS FOR ATTACHING SOLDER MEMBERS TO A SUBSTRATE
The invention discloses a method for attaching solder members ( 114 ) to a substrate ( 112 ). The method includes forming a decal ( 110 ) with a plurality of solder members ( 114 ). The method further comprises aligning the decal ( 110 ) with the substrate ( 112 ) and transferring the solder members...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | The invention discloses a method for attaching solder members (
114
) to a substrate (
112
). The method includes forming a decal (
110
) with a plurality of solder members (
114
). The method further comprises aligning the decal (
110
) with the substrate (
112
) and transferring the solder members (
114
) on the decal (
110
) to the substrate (
112
). |
|---|