Trench MOSFET formed using selective epitaxial growth

A method of creating a thermally grown oxide of any thickness at the bottom of a silicon trench. A dielectric (e.g. oxide) pillar of a predetermined thickness is formed on a semiconductor substrate. A selective epitaxial growth (SEG) process is used to form an epitaxial layer around and over the oxi...

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Bibliographische Detailangaben
Hauptverfasser: Sharp, Joelle, Madson, Gordon
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of creating a thermally grown oxide of any thickness at the bottom of a silicon trench. A dielectric (e.g. oxide) pillar of a predetermined thickness is formed on a semiconductor substrate. A selective epitaxial growth (SEG) process is used to form an epitaxial layer around and over the oxide pillars. A trench is patterned and etched through the SEG layer and in alignment with the oxide pillar such that the trench terminates at the top of the oxide pillar.