Method and system for decapsulating a multi-chip package

A method and system for decapsulating a multi-chip package is disclosed. The multi-chip package includes a first die and a second die. The first die resides above the second die. The method and system include mechanically removing at least a portion of the first die substantially without destroying the portion of a second die. The method and system also include removing a portion of the multi-chip package between the first die and the second die to expose a portion of the second die substantially without destroying the portion of a second die.