Apparatus for performing hydroforming operation

A hydroforming apparatus includes an upper platen carrying an upper die section and a lower platen carrying a lower die section. The platens are connected together by tie rods extending through respective compression tubes. The upper and lower die sections have recessed areas formed therein that define a die cavity. When the lower die section is moved to a lowered position, a workpiece can be disposed in the recessed area formed therein. Then, the lower die section and the workpiece are elevated by cylinders such that the workpiece is enclosed within the die cavity and mechanically deformed by the cooperated upper and lower die sections. A support block is then moved between the hydroforming die and the lower platen. A cylinder array containing a plurality of pistons is next hydraulically actuated so as to securely clamp the hydroforming die between the cylinder array and the lower platen. While the cylinder array is actuated, pressurized fluid is supplied within the workpiece, deforming it into conformance with the die cavity.