Anti-deciphering contacts

A method of making an integrated circuit that is resistant to an unauthorized duplication through reverse engineering includes forming a plurality of false contacts and/or false interconnection vias in the integrated circuit. These false contacts and/or false interconnection vias are connected as true contacts and true interconnection vias by lines patterned in a metallization layer deposited over an insulating dielectric layer or multilayer through which the true contacts and/or the true interconnection vias are formed. False contacts and false vias extend in the respective dielectric layers or multilayers to a depth insufficient to reach the active areas of a semiconductor substrate for false contacts, or to a depth insufficient to reach a layer of conductive material below the dielectric layers or multilayers for interconnection vias.