Wire bonding apparatus and wire bonding method
A principal object is to provide a wire bonding apparatus which is improved to be capable of connecting a metal fine wire at a normal position on a bonding pad of an IC chip so that there will be no variations in the positions of a die pad and the IC chip at the time of bonding. A platen is disposed...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A principal object is to provide a wire bonding apparatus which is improved to be capable of connecting a metal fine wire at a normal position on a bonding pad of an IC chip so that there will be no variations in the positions of a die pad and the IC chip at the time of bonding. A platen is disposed on a heat block in accordance with the shape of an IC lead frame for enlarging a heat transfer surface. A heating part for heating an IC chip and a preheating part for preheating an IC chip that is to be heated next are disposed on a surface of the platen. |
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