Contact structure for connecting two substrates and also process for producing such a contact structure
A contact structure ( 10 ) and a process for producing a contact structure are provided for connecting two substrates ( 11, 12 ). The process includes applying solder material ( 23 ) to terminal areas ( 16 ) of a first substrate ( 11 ) to form spacing metallizations ( 19 ), and bonding of the first...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A contact structure (
10
) and a process for producing a contact structure are provided for connecting two substrates (
11, 12
). The process includes applying solder material (
23
) to terminal areas (
16
) of a first substrate (
11
) to form spacing metallizations (
19
), and bonding of the first substrate (
11
) with a second substrate (
12
). The bonding between the terminal areas (
16
) of the first substrate (
11
) and a contact surface area of the second substrate (
12
) is performed by means of an electrically conductive adhesive compound (
20
). |
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