Semiconductor device array having dense memory cell array and hierarchical bit line scheme
A semiconductor device architecture ( 200 ) is disclosed. Like unit circuits ( 202 ), arranged in rows and columns, are coupled to lower conductive segments ( 204 a - 204 h ). The lower conductive segments ( 204 a - 204 h ) are arranged in an "open" configuration, allowing adjacent unit ci...
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Zusammenfassung: | A semiconductor device architecture (
200
) is disclosed. Like unit circuits (
202
), arranged in rows and columns, are coupled to lower conductive segments (
204
a
-
204
h
). The lower conductive segments (
204
a
-
204
h
) are arranged in an "open" configuration, allowing adjacent unit circuits (
202
) be accessed simultaneously. The lower conductive segments (
204
a
-
204
h
) are coupled to higher conductive segments (
208
a
-
208
f
) by reconnector circuits (
210
a
and
210
b
). The higher conductive segments (
208
a
-
208
f
) are arranged into folded pairs (
208
a/
208
d,
208
b/
208
e
and
208
c/
208
f
) between differential-type amplifiers (
212
a
and
212
b
). The reconnector circuits (
210
a
and
210
b
) each have a reconnect configuration and a switch configuration. In a reconnect configuration, the reconnector circuits (
210
a
and
210
b
) couple adjacent folded higher conductive segment pairs to one another. In a switch configuration, the reconnector circuits (
210
a
and
210
b
) couple a matching lower conductive segment (
204
a
-
204
h
) to each higher conductive segment of the adjacent higher conductive segment pairs. |
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