Semiconductor device and method for manufacturing same
A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface la thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1 b opposite to the main surface 1 a of the semiconductor chip 1, and a side portion 1...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method of making a semiconductor chip
1
having a first electrodes
11, 12
on main surface la thereof, a second electrode
13
made of a conductive resin electrode having a base portion
131
in contact with a surface
1
b
opposite to the main surface
1
a
of the semiconductor chip
1,
and a side portion
132
extended from one end portion of the base portion
131
in the direction toward the main surface
1
a
of the semiconductor chip
1,
wherein an end part of the side portion
132
of the second electrode
13
is exposed on the same side as the first electrodes
11, 12. |
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