Semiconductor device and method for manufacturing same

A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface la thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1 b opposite to the main surface 1 a of the semiconductor chip 1, and a side portion 1...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Yoshitake, Tomonobu, Sakazaki, Atsushi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of making a semiconductor chip 1 having a first electrodes 11, 12 on main surface la thereof, a second electrode 13 made of a conductive resin electrode having a base portion 131 in contact with a surface 1 b opposite to the main surface 1 a of the semiconductor chip 1, and a side portion 132 extended from one end portion of the base portion 131 in the direction toward the main surface 1 a of the semiconductor chip 1, wherein an end part of the side portion 132 of the second electrode 13 is exposed on the same side as the first electrodes 11, 12.