PROCESS CHAMBER HAVING IMPROVED TEMPERATURE CONTROL

A temperature control system 145 is used to control the temperature of a process chamber 25 during processing of a semiconductor substrate 70 . The temperature control system 145 comprises a heat exchanger plate 155 for removing heat from the chamber 25 , and a heat transfer member 158 for conducting heat to the heat exchanger plate 155 . The heat transfer member 158 comprises a lower heat conduction surface 205 bonded to an external surface of the chamber 25 , and an upper heat transmitting surface 210 thermally coupled to the heat exchanger plate 155 . Preferably, the temperature control assembly comprises a heater 150 for heating the chamber 25 , and a computer control system 165 for regulating the heat removed by the heat exchanger plate 155 as well as the heat supplied by the heater 150 , to maintain the chamber 25 at substantially uniform temperatures.