ENCAPSULATING COMPOSITION AND ENCAPSULATING FILM COMPRISING SAME AND ELECTRONIC COMPONENT ASSEMBLY

3The present invention discloses an encapsulation composition, an encapsulation film including the encapsulation composition, and an electronic device module. The encapsulation composition includes a polymer matrix, a tackifier and a free radical initiator. Based on 100 parts by weight of the polymer matrix, the polymer matrix includes 5 to 100 parts by weight of highly branched polyethylene (P1), 0 to 95 parts by weight of an ethylene-α-olefin copolymer, and 0 to 70 parts by weight of an ethylene-polar monomer copolymer. The highly branched polyethylene (P1) is an ethylene homopolymer having a branch structure and has a degree of branching of not less than 40 branches/1,000 carbon atoms. A density of the ethylene-α-olefin copolymer is not higher than 0.91 g/cm. The encapsulation composition provided by the present invention has good volume resistivity, aging resistance, processability and low cost.