Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform

[EN] We review recent work done by the photonics packaging platform ePIXpack that serves the academic community with packaging and assembly developments in the area of integrated photonics. The paper includes recent examples of our packaging and assembly work, covering a broad range of technologies from silicon photonics to InP-based devices This work was supported in part by the European Union (EU)-funded FP6-project ePIXnet, and in part by the FP7-project BOOM. Zimmermann, L.; Preve, GB.; Tekin, T.; Rosin, T.; Landles, K. (2011). Packaging and assembly for integrated photonics - a review of the ePIXpack photonics packaging platform. IEEE Journal of Selected Topics in Quantum Electronics. 17(3):645-651. https://doi.org/10.1109/JSTQE.2010.2084992