Simulation of SiC High Power Devices

The impact of SiC on high power devices and their applications is analysed using simulations in a very wide range of design voltages. First, a detailed presentation of the anisotropic form of the basic equations and of the physical models for 4H‐SiC used in the simulations is given. Following that the application ranges of unipolar and bipolar devices in the domains of voltage and frequency are predicted in the case of IGBTs versus MOSFETs and PiN versus Schottky rectifiers based on comparisons of the on‐state voltage and of the total losses. The application limit of the MOSFETs compared to IGBTs and of the Schottky rectifiers compared to PiN rectifiers is predicted to be about 4.5 and 2.5 kV, respectively, in the case of the 4H‐SiC polytype. The impact of technological limitations of SiC is illustrated by the case of low channel mobility. The merits of SiC as compared to Si are illustrated by the case of a SiC rectifier operating together with a Si IGBT. Dramatically reduced turn‐on losses are demonstrated. The superiority of SiC from the point of view of dynamic avalanche is predicted and illustrated. Finally, some novel SiC switch structures are introduced in response to the reliability problems encountered in ordinary trench MOSFETs.