Nano SiC enhancement in the BN micro structure for high thermal conductivity epoxy composite

Improving the heat dissipation efficiency of electronic products is the key to the design of many modern electronic and mechanical systems. Herein, we combined the 3D network fabricating with the way of micron-nano reinforcement to prepare high thermal conductivity and excellent thermal stability composites. Epoxy resin was used as the matrix, while the silicon carbide foam (f-SiC) as skeleton and the BN/nano-SiC as thermally conductive fillers. The thermal conductivity of the EP/f-SiC/BN/nano-SiC composite reaches 3.5 W·m − 1 ·K − 1 , which is about 16.6 times higher than that of pure epoxy resin. The characterization results of TC and infrared thermography images indicate that the EP/f-SiC/BN/nano-SiC composite possess superior heat transport performance. Meantime, the EP/f-SiC/BN/nano-SiC composite have excellent thermal stability, the T HRI of EP/f-SiC/BN/nano-SiC reaches 195.8℃, which is 21.3℃ higher than that of pure EP. This work would provide a new strategy for improving the TC of polymers by using other 3D skeletons and micron-nano fillers, and is conducive to the development of high thermal conductivity and excellent thermal stability materials.