A combined view on composition, molecular structure, and micromechanics of fungal degraded softwood

Fungal decay alters the composition, microstructure, and mechanical properties of wood cell walls. To understand better the structure-function relationships during fungal decay, selected annual rings of fungal deteriorated Scots pine sapwood were analyzed in terms of their composition, microstructure, and micromechanical properties. The datasets were acquired separately for earlywood and latewood concerning the S2 cell wall layer and the cell corner middle lamella (CCML) and analyzed by means of principal component analysis and partial least squares regression analysis. Links between cell wall stiffness and hardness and the composition and microstructure could be established. Increased mechanical properties in the CCML, as obtained by nanoindentation, were correlated to the degradation of pectins. In the S2 layer, the altered data were related to the degradation of hemicelluloses and lignin modification during fungal decay.