Lateral growth and three-dimensional effects in contacts between NiSi0.82Ge0.18 and p+-Si0.82Ge0.18

Electrical contacts of NiSi0DDT82Ge0DDT18 to p+-Si0DDT82Ge0DDT18 were fabricated and characterised. Lateral growth of the NiSi0DDT82Ge0DDT18 under SiO2 isolation was observed. A three-dimensional model was employed to extract the contact resistivity by considering both the lateral growth and the pre...

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Veröffentlicht in:Thin solid films 2005-10, Vol.489 (1-2), p.159-163
Hauptverfasser: PERSSON, S, ISHEDEN, C, JANUARY, T, ZHANG, S.-L
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Sprache:eng
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Zusammenfassung:Electrical contacts of NiSi0DDT82Ge0DDT18 to p+-Si0DDT82Ge0DDT18 were fabricated and characterised. Lateral growth of the NiSi0DDT82Ge0DDT18 under SiO2 isolation was observed. A three-dimensional model was employed to extract the contact resistivity by considering both the lateral growth and the presence of a recessed NiSi0DDT82Ge0DDT18 step into the Si0DDT82Ge0DDT18. The contact resistivity extracted was 5DDT0x10-8and 1DDT4x10-7D*W cm2for small contacts of circular geometry and large contacts of square shape, respectively. Possible causes responsible for this 3-fold difference in contact resistivity were discussed. An underestimate of the contact resistivity by 35% was found if a two-dimensional model was used without taking into account the complex interface morphology.
ISSN:0040-6090
1879-2731
1879-2731
DOI:10.1016/j.tsf.2005.04.090