Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

The wettability of Pb-free Sn-based solder over the Cu-based Cu60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a...

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Veröffentlicht in:	Journal of materials research 2009-09, Vol.24 (9), p.2931-2934
Hauptverfasser:	Imai, A., Katayama, M., Maruyama, S., Nishikawa, H., Wada, T., Kimura, H., Fukuhara, M., Takemoto, T., Inoue, A., Matsumoto, Y.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied and Technical Physics Biomaterials Inorganic Chemistry Joining Materials Engineering Materials Science Morphology Nanotechnology Surface chemistry
Online-Zugang:	Volltext
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