Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

Improved wettability of Sn-based solder over the Cu60Zr30Ti10 bulk metallic glass surface

The wettability of Pb-free Sn-based solder over the Cu-based Cu60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a...

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Veröffentlicht in:Journal of materials research 2009-09, Vol.24 (9), p.2931-2934
Hauptverfasser: Imai, A., Katayama, M., Maruyama, S., Nishikawa, H., Wada, T., Kimura, H., Fukuhara, M., Takemoto, T., Inoue, A., Matsumoto, Y.
Format: Artikel
Sprache:eng
Schlagworte:
Applied and Technical Physics
Biomaterials
Inorganic Chemistry
Joining
Materials Engineering
Materials Science
Morphology
Nanotechnology
Surface chemistry
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Zusammenfassung:The wettability of Pb-free Sn-based solder over the Cu-based Cu60Zr30Ti10 bulk metallic glass surface was investigated. We observed that the as-polished surface was nonwetting for the solder, which was due to the surface oxide layer of ZrOx formed in air. After complete removal of the oxide layer, a thin layer of Ag was deposited on the clean Cu60Zr30Ti10 surface. The Ag-covered Cu60Zr30Ti10 surface showed relatively high resistivity to the reoxidation even in air, and thus the wettability of the Cu60Zr30Ti10 surface for the Sn-based solder was greatly improved.
ISSN:0884-2914
2044-5326
DOI:10.1557/jmr.2009.0343