Characterization of electron-beam deposited SnS films: Processing, properties, and ohmic contacts

Nanocrystalline tin sulfide (SnS) thin films were deposited by electron-beam evaporation at growth temperatures ranging from room temperature to 300 °C and characterized prior to and after annealing at 300 °C in high vacuum. X-ray diffraction and Raman spectroscopy results indicated that SnS films deposited at 100 and 200 °C contained predominately a mixture of orthorhombic α-SnS and cubic π-SnS phases, whereas only α-SnS was detected in SnS films deposited at 300 °C. Contacts with a range of work functions were deposited onto p-type α-SnS films. All of the contacts investigated (Ti/Au, Ru/Au, Ni/Au, and Au) were ohmic as-deposited and yielded average specific contact resistance values that decreased with increasing metal work function, suggesting that the barrier height has at least a partial dependence on the work functions of the metals. Annealing at 350 °C for 5 min in Ar reduced the specific contact resistance value for Ru/Au contacts, resulting in the lowest value (1.9 × 10−3 Ω cm2) of contacts investigated to SnS thin films.