Atomic layer deposition of carbon doped silicon oxide by precursor design and process tuning

Different precursors for atomic layer deposition of carbon doped silicon oxide have been investigated. The impact of precursor reactivity, the number of silicon-carbon bonds in the precursor, oxidant concentration and dosing time, and deposition temperature on deposited film's carbon content are discussed. It is found that substituting the Si-H by Si-CH3 reduces precursor reactivity and decreases film growth per cycle (GPC). At temperatures higher than 225 °C, all the precursors could deposit a silicon oxide films with reasonable GPC but with very little carbon in the film (