Characterization of thin film adhesion by MEMS shaft-loading blister testing
A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, a...
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| Veröffentlicht in: | Journal of vacuum science & technology. A, Vacuum, surfaces, and films Vacuum, surfaces, and films, 2013-05, Vol.31 (3) |
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| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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| Zusammenfassung: | A new microelectromechanical system shaft-loaded blister test was developed and demonstrated to provide stability, repeatability, and simultaneous quantitative measurements of adhesion between thin films deposited on a silicon substrate. The authors assessed adhesion of sputtered platinum, copper, and chromium/copper (300 nm) to underlaying atomic layer deposited (ALD) aluminum oxide. The average adhesion energies for thin films on ALD aluminum oxide were found to be 1.15 ± 0.1 J/m2 for platinum thin films, 1.4 J/m2 for copper thin films, and 1.75 J/m2 for chromium/copper. |
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| ISSN: | 0734-2101 1520-8559 |
| DOI: | 10.1116/1.4801921 |