Dual-sputtered process sensitivity of HfGdO charge-trapping layer in SONOS-type nonvolatile memory

The charge-trapping layer of HfGdO dielectrics deposited by a dual-sputtered process for a silicon-oxide-nitride-oxide-silicon-type nonvolatile memory application was investigated. Different Ar / O 2 flow ratios and Hf/Gd dual-sputtered power ratios were performed and the process sensitivity on the...

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Veröffentlicht in:Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2011-01, Vol.29 (1), p.11009
Hauptverfasser: Wang, Jer-Chyi, Chou, Pai-Chi, Lai, Chao-Sung, Liu, Li-Chi
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container_title Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena
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creator Wang, Jer-Chyi
Chou, Pai-Chi
Lai, Chao-Sung
Liu, Li-Chi
description The charge-trapping layer of HfGdO dielectrics deposited by a dual-sputtered process for a silicon-oxide-nitride-oxide-silicon-type nonvolatile memory application was investigated. Different Ar / O 2 flow ratios and Hf/Gd dual-sputtered power ratios were performed and the process sensitivity on the memory characteristics was analyzed. It is observed that the nonstoichiometric GdO (200) structure may be the main charge-trapping site for the HfGdO silicon-oxide-nitride-oxide-silicon-type memories. The memories with Hf / Gd = 150 / 150 and Ar / O 2 = 20 / 5 exhibit better electrical performance than others and can be applied into future nonvolatile memory.
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title Dual-sputtered process sensitivity of HfGdO charge-trapping layer in SONOS-type nonvolatile memory
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