Fabrication and field emission characteristics of lateral diamond field emitter

Lateral diamond field emitters were fabricated by a diamond patterning technique that utilizes oxide patterning and lift-off process on a silicon-on-insulator wafer. An anode–cathode spacing of 2 μm between the diamond anode and cathode was achieved. The fabricated lateral diamond emitter diode exhi...

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Veröffentlicht in:Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2003-01, Vol.21 (1), p.593-596
Hauptverfasser: Kang, W. P., Davidson, J. L., Wisitsora-at, A., Howell, M., Jamaludin, A., Wong, Y. M., Soh, K. L., Kerns, D. V.
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Sprache:eng
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Zusammenfassung:Lateral diamond field emitters were fabricated by a diamond patterning technique that utilizes oxide patterning and lift-off process on a silicon-on-insulator wafer. An anode–cathode spacing of 2 μm between the diamond anode and cathode was achieved. The fabricated lateral diamond emitter diode exhibits excellent emission characteristics with a low turn-on voltage of ∼5  V and a high emission current of 6 μA, from four diamond fingers, at an anode voltage of 25 V. The emission current is stable over time, even at high emission current. The low turn-on voltage (turn-on field ∼3  V /μ m ) and high emission characteristics are among the best of reported lateral field emitter structures. The lateral diamond field emitter has potential applications in vacuum microelectronics, sensors, and microelectromechanical systems.
ISSN:0734-211X
1071-1023
1520-8567
DOI:10.1116/1.1516187