Fabrication and field emission characteristics of lateral diamond field emitter
Lateral diamond field emitters were fabricated by a diamond patterning technique that utilizes oxide patterning and lift-off process on a silicon-on-insulator wafer. An anode–cathode spacing of 2 μm between the diamond anode and cathode was achieved. The fabricated lateral diamond emitter diode exhi...
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Veröffentlicht in: | Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 2003-01, Vol.21 (1), p.593-596 |
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Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | Lateral diamond field emitters were fabricated by a diamond patterning technique that utilizes oxide patterning and lift-off process on a silicon-on-insulator wafer. An anode–cathode spacing of 2 μm between the diamond anode and cathode was achieved. The fabricated lateral diamond emitter diode exhibits excellent emission characteristics with a low turn-on voltage of
∼5
V
and a high emission current of 6 μA, from four diamond fingers, at an anode voltage of 25 V. The emission current is stable over time, even at high emission current. The low turn-on voltage (turn-on field
∼3
V
/μ
m
)
and high emission characteristics are among the best of reported lateral field emitter structures. The lateral diamond field emitter has potential applications in vacuum microelectronics, sensors, and microelectromechanical systems. |
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ISSN: | 0734-211X 1071-1023 1520-8567 |
DOI: | 10.1116/1.1516187 |