Quantitative voltage measurement of high-frequency internal integrated circuit signals by scanning probe microscopy
This article describes a scanning probe microscopy technique for quantitative high-speed voltage wave form measurement inside an operating integrated circuit. Internal signals are determined by sensing the local electrostatic force on a noncontacting micromachined probe cantilever that is closely po...
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Veröffentlicht in: | Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films Surfaces, and Films, 2002-05, Vol.20 (3), p.999-1003 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | This article describes a scanning probe microscopy technique for quantitative high-speed voltage wave form measurement inside an operating integrated circuit. Internal signals are determined by sensing the local electrostatic force on a noncontacting micromachined probe cantilever that is closely positioned above the circuit test point. Amplitude modulation based downconversion is employed to measure repetitive high-frequency signals which can have a bandwidth much greater than the mechanical response of the probe. A force-nulling technique is used to obtain accurate absolute voltages without the need for complex calibration or precise probe positioning, and enables direct measurement of passivated circuits. A method of eliminating dc offset errors, such as that due to material work function differences, is described. Measurement of signals on the passivated interconnects of a wideband distributed amplifier is presented. The instrument demonstrates a voltage accuracy of |
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ISSN: | 0734-2101 1520-8559 |
DOI: | 10.1116/1.1460901 |