Optimizing interface properties of HfO2/Si0.73Ge0.27 gate stacks through sulfur passivation and post-deposition annealing

This paper presents a comprehensive exploration of low interface trap density (Dit) in HfO2/Si0.73Ge0.27 metal-oxide semiconductor (MOS) capacitors achieved through sulfur passivation and post-deposition annealing (PDA). Our investigation revealed that devices subjected to sulfur passivation and PDA...

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Veröffentlicht in:Journal of applied physics 2024-03, Vol.135 (12)
Hauptverfasser: Chen, Zhengyang, Lan, Zhangsheng, Lin, Yiran, Nishimura, Tomonori, Lee, Choonghyun, Zhao, Yi
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Sprache:eng
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Zusammenfassung:This paper presents a comprehensive exploration of low interface trap density (Dit) in HfO2/Si0.73Ge0.27 metal-oxide semiconductor (MOS) capacitors achieved through sulfur passivation and post-deposition annealing (PDA). Our investigation revealed that devices subjected to sulfur passivation and PDA exhibit noteworthy reductions in Dit and hysteresis. Specifically, a low Dit value of 1.2 × 1011 eV−1 cm−2 has been achieved at Ei–0.1 eV for the SiGe MOS device. The observed enhancement in interface properties can be attributed to two key factors: the reduction of the GeOx concentration in the interfacial layer (IL) by sulfur passivation on the SiGe surface and the IL densification with stoichiometric oxygen during PDA.
ISSN:0021-8979
1089-7550
DOI:10.1063/5.0195430