Optimizing interface properties of HfO2/Si0.73Ge0.27 gate stacks through sulfur passivation and post-deposition annealing
This paper presents a comprehensive exploration of low interface trap density (Dit) in HfO2/Si0.73Ge0.27 metal-oxide semiconductor (MOS) capacitors achieved through sulfur passivation and post-deposition annealing (PDA). Our investigation revealed that devices subjected to sulfur passivation and PDA...
Gespeichert in:
Veröffentlicht in: | Journal of applied physics 2024-03, Vol.135 (12) |
---|---|
Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | This paper presents a comprehensive exploration of low interface trap density (Dit) in HfO2/Si0.73Ge0.27 metal-oxide semiconductor (MOS) capacitors achieved through sulfur passivation and post-deposition annealing (PDA). Our investigation revealed that devices subjected to sulfur passivation and PDA exhibit noteworthy reductions in Dit and hysteresis. Specifically, a low Dit value of 1.2 × 1011 eV−1 cm−2 has been achieved at Ei–0.1 eV for the SiGe MOS device. The observed enhancement in interface properties can be attributed to two key factors: the reduction of the GeOx concentration in the interfacial layer (IL) by sulfur passivation on the SiGe surface and the IL densification with stoichiometric oxygen during PDA. |
---|---|
ISSN: | 0021-8979 1089-7550 |
DOI: | 10.1063/5.0195430 |