PCMs and hybrid nanoparticles based thermal management strategy for cooling electronic components
This paper deals with mathematical and numerical modeling of a heat sink based on phase change materials (PCM) and single and hybrid nanoparticles for cooling electronic components. It is a transient and two-dimensional model. Two electronic components are mounted in the center of the bottom wall oc...
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| creator | Faraji, Hamza Arshad, Adeel Alami, Mustapha El Aamouche, Ahmed Choukairy, Khadija Semma, Elalami |
| description | This paper deals with mathematical and numerical modeling of a heat sink based on phase change materials (PCM) and single and hybrid nanoparticles for cooling electronic components. It is a transient and two-dimensional model. Two electronic components are mounted in the center of the bottom wall occupied by a substrate playing the role of a motherboard. The system of transient equations is solved numerically by adopting the finite volume method. The enthalpy-porosity technique is used to model the phase change phenomenon. Based on the results found, it was found that the addition of hybrid nanoparticles instead of single nanoparticles is a promising solution for a long time using electronic components. This thermal behavior is due to the ability of the hybrid nanoparticles to enhance the effective thermal effusivity of the hybrid NePCM. |
| doi_str_mv | 10.1063/5.0171586 |
| format | Conference Proceeding |
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It is a transient and two-dimensional model. Two electronic components are mounted in the center of the bottom wall occupied by a substrate playing the role of a motherboard. The system of transient equations is solved numerically by adopting the finite volume method. The enthalpy-porosity technique is used to model the phase change phenomenon. Based on the results found, it was found that the addition of hybrid nanoparticles instead of single nanoparticles is a promising solution for a long time using electronic components. 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This thermal behavior is due to the ability of the hybrid nanoparticles to enhance the effective thermal effusivity of the hybrid NePCM.</description><subject>Cooling</subject><subject>Electronic components</subject><subject>Enthalpy</subject><subject>Finite volume method</subject><subject>Heat sinks</subject><subject>Mathematical models</subject><subject>Motherboards</subject><subject>Nanoparticles</subject><subject>Numerical models</subject><subject>Phase change materials</subject><subject>Substrates</subject><subject>Thermal effusivity</subject><subject>Thermal management</subject><subject>Thermodynamic properties</subject><subject>Two dimensional models</subject><issn>0094-243X</issn><issn>1551-7616</issn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2023</creationdate><recordtype>conference_proceeding</recordtype><recordid>eNotkM9LwzAYhoMoOKcH_4OAN6EzX9MkzVGGv2Cihx28la9p2nW0SU2yw_57K9vphZeH94WHkHtgK2CSP4kVAwWilBdkAUJApiTIS7JgTBdZXvCfa3IT456xXCtVLgh-rz8jRdfQ3bEOfUMdOj9hSL0ZbKQ1RtvQtLNhxIGO6LCzo3WJxhQw2e5IWx-o8X7oXUftYE0K3vVmrsbJu5mMt-SqxSHau3Muyfb1Zbt-zzZfbx_r5002acmzgkvVMoCmFjUayUwJoErZKCPbWoNulcBGImit6yIvJWoGVgM3QnGr0fIleTjNTsH_HmxM1d4fgpsfq7xUnAkAXc7U44mKpk-Yeu-qKfQjhmMFrPo3WInqbJD_AdzwY5g</recordid><startdate>20231005</startdate><enddate>20231005</enddate><creator>Faraji, Hamza</creator><creator>Arshad, Adeel</creator><creator>Alami, Mustapha El</creator><creator>Aamouche, Ahmed</creator><creator>Choukairy, Khadija</creator><creator>Semma, Elalami</creator><general>American Institute of Physics</general><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20231005</creationdate><title>PCMs and hybrid nanoparticles based thermal management strategy for cooling electronic components</title><author>Faraji, Hamza ; Arshad, Adeel ; Alami, Mustapha El ; Aamouche, Ahmed ; Choukairy, Khadija ; Semma, Elalami</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p963-4367f011db5bac60c811786d7c6fb919f75ad6a1999b4286a901e913c573e9ae3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2023</creationdate><topic>Cooling</topic><topic>Electronic components</topic><topic>Enthalpy</topic><topic>Finite volume method</topic><topic>Heat sinks</topic><topic>Mathematical models</topic><topic>Motherboards</topic><topic>Nanoparticles</topic><topic>Numerical models</topic><topic>Phase change materials</topic><topic>Substrates</topic><topic>Thermal effusivity</topic><topic>Thermal management</topic><topic>Thermodynamic properties</topic><topic>Two dimensional models</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Faraji, Hamza</creatorcontrib><creatorcontrib>Arshad, Adeel</creatorcontrib><creatorcontrib>Alami, Mustapha El</creatorcontrib><creatorcontrib>Aamouche, Ahmed</creatorcontrib><creatorcontrib>Choukairy, Khadija</creatorcontrib><creatorcontrib>Semma, Elalami</creatorcontrib><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Faraji, Hamza</au><au>Arshad, Adeel</au><au>Alami, Mustapha El</au><au>Aamouche, Ahmed</au><au>Choukairy, Khadija</au><au>Semma, Elalami</au><au>Belkassmi, Youssef</au><au>Maimouni, Lahoucine El</au><au>Ait-Taleb, Thami</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>PCMs and hybrid nanoparticles based thermal management strategy for cooling electronic components</atitle><btitle>AIP conference proceedings</btitle><date>2023-10-05</date><risdate>2023</risdate><volume>2761</volume><issue>1</issue><issn>0094-243X</issn><eissn>1551-7616</eissn><coden>APCPCS</coden><abstract>This paper deals with mathematical and numerical modeling of a heat sink based on phase change materials (PCM) and single and hybrid nanoparticles for cooling electronic components. 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| fulltext | fulltext |
| identifier | ISSN: 0094-243X |
| ispartof | AIP conference proceedings, 2023, Vol.2761 (1) |
| issn | 0094-243X 1551-7616 |
| language | eng |
| recordid | cdi_scitation_primary_10_1063_5_0171586 |
| source | AIP Journals Complete |
| subjects | Cooling Electronic components Enthalpy Finite volume method Heat sinks Mathematical models Motherboards Nanoparticles Numerical models Phase change materials Substrates Thermal effusivity Thermal management Thermodynamic properties Two dimensional models |
| title | PCMs and hybrid nanoparticles based thermal management strategy for cooling electronic components |
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