PCMs and hybrid nanoparticles based thermal management strategy for cooling electronic components

This paper deals with mathematical and numerical modeling of a heat sink based on phase change materials (PCM) and single and hybrid nanoparticles for cooling electronic components. It is a transient and two-dimensional model. Two electronic components are mounted in the center of the bottom wall occupied by a substrate playing the role of a motherboard. The system of transient equations is solved numerically by adopting the finite volume method. The enthalpy-porosity technique is used to model the phase change phenomenon. Based on the results found, it was found that the addition of hybrid nanoparticles instead of single nanoparticles is a promising solution for a long time using electronic components. This thermal behavior is due to the ability of the hybrid nanoparticles to enhance the effective thermal effusivity of the hybrid NePCM.