Analysis of the laterally bent piezoelectric semiconductor fibers with variable cross sections

Piezoelectric semiconductor (PS) materials have attracted much attention in recent years due to their unique properties. This paper explores the electromechanical coupling behavior of bent piezoelectric semiconductor fibers with non-uniform cross-sectional areas. The study uses the generalized diffe...

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Veröffentlicht in:Journal of applied physics 2023-05, Vol.133 (19)
Hauptverfasser: Xu, Zelin, Fang, Kai, Yu, Mengran, Wang, Tiqing, Li, Peng, Qian, Zhenghua, Liu, Dianzi
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Sprache:eng
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Zusammenfassung:Piezoelectric semiconductor (PS) materials have attracted much attention in recent years due to their unique properties. This paper explores the electromechanical coupling behavior of bent piezoelectric semiconductor fibers with non-uniform cross-sectional areas. The study uses the generalized differential quadrature method to numerically solve the field equations with variable coefficients derived from piezoelectric theory. The research examines the mechanical and electrical field distribution of bent variable cross-sectional fibers, comparing the performances of non-uniform fibers with different profiles. The study reveals that the variable cross-sectional profile of the fiber changes the characteristic of the uniform fiber’s electrical distribution along the axis, and it exhibits a more sensitive and stronger electrical response to the same external force. The research also shows that the concavity and convexity of the radius distribution function of the non-uniform fibers determine whether there are extreme points of surface potential. Finally, the study suggests that by designing extreme points of the PS fiber profile, surface potential extreme points can be artificially created at the same location. These results offer a theoretical direction for creating advanced piezoelectric semiconductor nanodevices and present novel insights into designing higher-efficiency nanogenerators and mechanical strain sensors in the future.
ISSN:0021-8979
1089-7550
DOI:10.1063/5.0152306