Optimization of heat sink geometry for cooling of microchips

As we pack electronics into more smaller packages, dealing with the heat they produce is becoming a growing challenge. In case of high-performance CPUs, technologies are in great demand to handle cooling of microprocessors based on tiny silicon-based microchips. In this article, a computational analysis has been done to optimize the heat sink performance for Intel core i9 7900X microchip. For realistic simulation, a typical CPU environment has been modeled with standard materials using electronic design module of ANSYS. An effort has been made to find out the optimum number and height of metal fins for maintaining a certain maximum temperature towards better working efficiency of the microchip material. It has been found that a heatsink with more fins and lesser fin height is suitable for the optimum working of the processor microchip.