Studying the best performance of the CPU thermal conductivity chemical material with the lowest possible deformation

Thermal managing is necessary for electronics products. The study of the computational fluid dynamics of the heat sink for thermal management is explained. This article focuses on the numerical investigation of temperature distribution (thermal steady-state) and static structural in central processing units (CPU) case with different types of the chemical material which is fix processor to fins. Three forms (cross, dot, and fully) of various materials have been studied. The materials tested in this work are (TG-S808 Thermal grease, TG-N909 Non-silicone, S606B thermal grease, and S606C thermal grease). The thermal and structural analyses are applied with a commercial package providing via ANSYS Fluent. The results show S606B material and dot form are the best choices to produce quick heat transfer and less deformation and stress of the fins. The difference of temperature distribution in the case of steady state thermal at dot form is better than the two others (cross and fully). The temperature at the cross form and S606B dropped from 71.427 to 67.858 degrees Celsius. At the same shape and time interval, material S606B exhibited the least deformation matching to the other materials. Using N909 material in dot form for 1 hour of PC operation results in less deformation than using the same material in full and cross form. S606B has been demonstrated to be the best material for reducing stress in all kinds.