Investigation of the influence of submicron spherical diamond particles and silicon whiskers on the thermal conductivity of thermal greases

Over the last decade, the rapid development of high-end electronics has led to the need for efficient dissipation of high heat flux densities. Consequently, more and more stringent requirements to the properties of thermal interface materials (TIM) are formed. Additions of submicron spherical diamond particles and silicon whiskers were considered to increase the thermal conductivity of polymer composites. Despite the composite material structure densification, the addition of diamond monotonically decreases the thermal conductivity. Silicon whiskers vice verse slightly rises it. The application of ultrasonic treatment (UST) with a frequency of 22±1.65 kHz and power 260 W for 15 minutes allows increasing the thermal conductivity of composite materials containing silicon whiskers by 5-10%.