Formation of intermetallic layer with multiwall carbon nanotubes reinforcement in Sn-0.7Cu solders on bare copper surface finish with laser soldering method

Reduction in scale of electronic devices or related components associated with the enhancing functionality demand improved performance in solder joint reliability. With respect to that, this project explores the possibilities of reinforcing Multi-Walled Carbon Nanotube (MWCNT) that are mainly made of carbon as a reinforcement agent into Sn-0.7Cu solder. The objective was to investigate the Intermetallic Compound (IMC) formation influence by the laser soldering method, to evaluate the distribution and interaction of MWCNT within the solder bulk ecosystem for Sn-0.7Cu lead-free solder. Powder metallurgical (PM) route was used to prepare the samples with different weight percentage (0wt%, 0.01wt%, 0.05wt%, 0.1wt%) of Multi-Walled Carbon Nanotube (MWCNT) added into Sn-0.7wt%Cu solders on bare copper surface finish. The melting temperature of the intrinsic solder of 0.1 wt.% MWCNT reinforced solder has a slightly decline with 0.19°C and also decrease in the melting range with a marginal difference of 0.29°C. FESEM analysis revealed MWCNT was homogenously distributed in the solder matrix.