Research on optimized structure of a 220-GHz extended interaction oscillator
The extended interaction oscillator has high power and efficiency advantages for terahertz vacuum electronic devices. The ladder line is a crucial high-frequency structure with strong coupling ability and can interact with the sheet beam to significantly improve the beam-wave interaction efficiency...
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Veröffentlicht in: | Physics of plasmas 2021-09, Vol.28 (9) |
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Hauptverfasser: | , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The extended interaction oscillator has high power and efficiency advantages for terahertz vacuum electronic devices. The ladder line is a crucial high-frequency structure with strong coupling ability and can interact with the sheet beam to significantly improve the beam-wave interaction efficiency and is widely studied and implemented. This paper presents an optimized structure, expanding the cavities on both sides based on the original ladder line structure. The TM11 mode is effectively suppressed in the optimized structure so that the sheet beam can interact with the TM31 mode, and the cavity characteristic impedance R/Q and output power are significantly improved. Based on the theoretical derivation of the original structure and the approximated analysis of the optimized structure, the change in dispersion with structure is discussed in this paper. The field distribution in the optimized structure based on the 0.22-THz frequency band is further studied and compared with the original structure by numerical calculation and particle simulation. Furthermore, the optimal operating voltage and output window parameters are analyzed using Particle-in-Cell software, and the surface loss simulation results are given. Finally, the cavity characteristic impedance R/Q is increased by 66.7%, the bandwidth is slightly increased compared with the original structure, and the output power is increased by 163.8%. The results of the preliminary processing and cold test are presented. |
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ISSN: | 1070-664X 1089-7674 |
DOI: | 10.1063/5.0063101 |