Strong magnon–photon coupling with chip-integrated YIG in the zero-temperature limit

The cross-integration of spin-wave and superconducting technologies is a promising method for creating novel hybrid devices for future information processing technologies to store, manipulate, or convert data in both classical and quantum regimes. Hybrid magnon–polariton systems have been widely stu...

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Veröffentlicht in:Applied physics letters 2021-07, Vol.119 (3), Article 033502
Hauptverfasser: Baity, Paul G., Bozhko, Dmytro A., Macêdo, Rair, Smith, William, Holland, Rory C., Danilin, Sergey, Seferai, Valentino, Barbosa, João, Peroor, Renju R., Goldman, Sara, Nasti, Umberto, Paul, Jharna, Hadfield, Robert H., McVitie, Stephen, Weides, Martin
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Sprache:eng
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Zusammenfassung:The cross-integration of spin-wave and superconducting technologies is a promising method for creating novel hybrid devices for future information processing technologies to store, manipulate, or convert data in both classical and quantum regimes. Hybrid magnon–polariton systems have been widely studied using bulk Yttrium Iron Garnet (Y3Fe5O12, YIG) and three-dimensional microwave photon cavities. However, limitations in YIG growth have, thus far, prevented its incorporation into CMOS compatible technologies, such as high-quality factor superconducting quantum technology. To overcome this impediment, we have used Plasma Focused Ion Beam (PFIB) technology—taking advantage of precision placement down to the micrometer scale—to integrate YIG with superconducting microwave devices. Ferromagnetic resonance has been measured at milliKelvin temperatures on PFIB-processed YIG samples using planar microwave circuits. Furthermore, we demonstrate strong coupling between superconducting resonators and YIG ferromagnetic resonance modes by maintaining reasonably low loss while reducing the system down to the micrometer scale. This achievement of strong coupling on-chip is a crucial step toward fabrication of functional hybrid quantum devices from spin-wave and superconducting components.
ISSN:0003-6951
1077-3118
DOI:10.1063/5.0054837