Mass attenuation coefficients, CT numbers and density profiles of soy protein concentrate-based Rhizophora spp. particleboards enhanced by NaOH/IA-PAE

This study involves the efficient fabrication of a novel radiation phantom material made of natural wood Rhizophora spp. (R. spp.) particleboard, using soy protein concentrate (SPC), NaOH, and a bio-based curing agent (itaconic acid polyamidoamine-epichlorohydrin) (IA-PAE) as critical components. Th...

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Hauptverfasser: Oluwafemi, Samson Damilola, Jafri, Mohd Zubir Mat, Hashim, Rokiah, Sulaiman, Othman, Aziz, Mohd Zahri Abdul, Yusof, Mohd Fahmi Mohd, Shukri, Ahmad
Format: Tagungsbericht
Sprache:eng
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Zusammenfassung:This study involves the efficient fabrication of a novel radiation phantom material made of natural wood Rhizophora spp. (R. spp.) particleboard, using soy protein concentrate (SPC), NaOH, and a bio-based curing agent (itaconic acid polyamidoamine-epichlorohydrin) (IA-PAE) as critical components. The structural properties of the phantom samples were investigated by field emission scanning electron microscopy (FE-SEM). Mass attenuation coefficients were determined using photons at XRF energies between 16.59 and 25.26 keV. CT numbers, electron densities, and density profiles were estimated using an X-ray computed tomography (CT) scanner and compared to water. The results showed that the physical, mechanical, and dimensional stability properties of the particleboards were significantly enhanced with 15 wt% IA-PAE content. All cured particleboard samples showed values of mass attenuation coefficients and an effective atomic number close to that of water with p-value>0.05. It was found that the CT number, electron density, and density profile of the particleboard phantom with 15 wt% IA-PAE agreed excellently with water at 80, 120, and 135 kVp CT energies. These findings indicate that NaOH/IA-PAE resin has the potency of ameliorating the performance capability of SPC-based adhesive, thereby making the R. spp. particleboard suitable as a tissue- and water-equivalent phantom material.
ISSN:0094-243X
1551-7616
DOI:10.1063/5.0039370