Comprehensive review on heat transfer characteristics of microchannel heat sinks

The recent advancements in electronic devices to increase its processing speed, performance, reliability and to decrease its form factor has significantly increased the heat generation within the system exponentially. The higher heat flux generation and reduced surface area to dissipate the heat due to the reduced form factor of the device has critical effects on the user’s health as well for products reliability and performance thus creating a need for a more compact and efficient device to tackle the thermal management challenges in the electronic components. Due to its compact size and enhanced heat transfer characteristics, Microchannel heat sinks (MCHS) proves to be an effective solution for complex thermal management problems. In this paper, comprehensive study of articles focused on MCHS from the current decade have been studied in order to further increase the performance of the MCHS and also to develop the novel techniques to synchronize the MCHS with other heat exchangers to solve evolving complex thermal challenges faced by the Industry today such as 5G devices, High powered LEDs, Automotive electronics and Medical electronics.