Low temperature Cu bonding with large tolerance of surface oxidation

A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key...

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Veröffentlicht in:	AIP advances 2019-05, Vol.9 (5), p.055127-055127-5
Hauptverfasser:	Ren, Hui, Mu, Fengwen, Shin, Seongbin, Liu, Lei, Zou, Guisheng, Suga, Tadatomo
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding strength Copper Formic acid Low temperature Nanoparticles Oxidation Surface analysis (chemical) Surface properties
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creator	Ren, Hui Mu, Fengwen Shin, Seongbin Liu, Lei Zou, Guisheng Suga, Tadatomo
description	A novel method of low temperature all-Cu bonding was developed, which has a large tolerance for Cu surface oxidation and can even bond Cu with a thick oxide layer at 250 °C. It is significant for the chip level bonding because traditional methods have strict requirements for surface quality. The key process is to combine Cu nanoparticle paste and Pt-catalyzed formic acid vapor, which improved the bonding strength of oxidized-Cu by ∼78.5% and is expected to simplify the bonding process. To understand the mechanisms, interfacial analyses of the microstructure and composition were carried out, along with a surface analysis.
doi_str_mv	10.1063/1.5097382
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subjects	Bonding strength Copper Formic acid Low temperature Nanoparticles Oxidation Surface analysis (chemical) Surface properties
title	Low temperature Cu bonding with large tolerance of surface oxidation
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