Impact of silicon epitaxial thickness layer in high power diode devices

The p-i-n diode is one of the earliest semiconductor devices developed for power circuit application. It is formed with the intrinsically doped i.e. i-layer sandwiched between the p-type and n-type layers. In this paper, we focus on the integration of the intrinsic region of silicon p-i-n diode to the current-voltage characteristics. In our structure, n-type refers to the bulk substrate and intrinsic region refers to the epitaxial layer of the silicon substrate. We make a thickness variation in the intrinsic region of p-i-n diode and how it affects diode performance. An additional layer is added on the epitaxial layer during the process to control the diffusion from the bottom of bulk substrate. Result shows that intrinsic layer optimization has successfully enhances the diode device robustness in terms of diode current-voltage characteristics, which reflects better manufacturing yield and improve the final product performance.