Topotaxial growth of Ti 2 Al N by solid state reaction in Al N ∕ Ti ( 0001 ) multilayer thin films

The formation of Ti 2 Al N by solid state reaction between layers of wurtzite-AlN and α - Ti was characterized by in situ x-ray scattering. The sequential deposition of these layers by dual magnetron sputtering onto Al 2 O 3 ( 0001 ) at 200 ° C yielded smooth, heteroepitaxial (0001) oriented films,...

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Veröffentlicht in:Applied physics letters 2007-04, Vol.90 (17), p.174106-174106-3
Hauptverfasser: Höglund, C., Beckers, M., Schell, N., Borany, J. v., Birch, J., Hultman, L.
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Zusammenfassung:The formation of Ti 2 Al N by solid state reaction between layers of wurtzite-AlN and α - Ti was characterized by in situ x-ray scattering. The sequential deposition of these layers by dual magnetron sputtering onto Al 2 O 3 ( 0001 ) at 200 ° C yielded smooth, heteroepitaxial (0001) oriented films, with abrupt Al N ∕ Ti interfaces as shown by x-ray reflectivity and Rutherford backscattering spectroscopy. Annealing at 400 ° C led to AlN decomposition and diffusion of released Al and N into the Ti layers, with formation of Ti 3 Al N . Further annealing at 500 ° C resulted in a phase transformation into Ti 2 Al N ( 0001 ) after only 5 min .
ISSN:0003-6951
1077-3118
DOI:10.1063/1.2731520