Influence of phonon, geometry, impurity, and grain size on Copperline resistivity

The authors report on the resistivity of submicron copper lines ranging from 75 to 500 nm linewidths as a function of temperature in the 10 K to 380 K interval. Their estimate of the contributions to electron scattering at 20 K for the narrowest line ( 75 nm linewidth) is 29% from copper surfaces, 25% from grain boundaries, and 30% from impurities, with the bulk resistivity making up the remaining 16%. It should be noted that at 300 K , the contribution of electron-phonon scattering is about 60% illustrating the benefit of studying different scattering mechanisms at cryogenic temperatures.